XCVC1502-2MLINSVG1369
XCVC1502-2MLINSVG1369
Part number
XCVC1502-2MLINSVG1369
Product Categories
System On Chip (SoC)
Manufacturer
Xilinx (AMD)
Describe
IC VERSAL AI-CORE FPGA 1369BGA
Encapsulation
-
Package
Tray
ROHS status
Yes
Price
USD $26,002.5000
Data sheet
Quantity
RFQ
In stock:
Smallest : 1
Multiple : 1
Quantity
Unit price
Price
1
$26,002.5000
$26,002.5000
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Purchase and inquiry
Specification
Transport
Data sheet
ABLIC U.S.A. Inc. S-1132B33-I6T2U has similar specifications, properties, parameters and parts as ABLIC U.S.A. Inc. S-1132B33-I6T2U.
TYPEDESCRIPTION
MfrXilinx (AMD)
SeriesVersal™ AI Core
PackageTray
Product StatusACTIVE
Package / Case1369-BFBGA, FCBGA
Speed600MHz, 1.4GHz
RAM Size256KB
Number of I/O478
Operating Temperature-40°C ~ 110°C (TJ)
Core ProcessorDual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary AttributesVersal™ AI Core FPGA, 800k Logic Cells
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
PeripheralsDDR, DMA, PCIe
Supplier Device Package1369-FCBGA (35x35)
ArchitectureMPU, FPGA

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FedEx International, 5-7 business days.

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transport

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